Mask Alignment Correction

In the semiconductor manufacturing process, mask alignment correction is a very important step used to correct the differences between the mask and the resulting chip patterns. The application of piezoelectric technology in mask correction is mainly reflected in adjusting the mask shape and controlling the gap between masks. By utilizing piezoelectric technology, the mask can achieve higher shape accuracy and flatness during the manufacturing process. At the same time, actuators made using the piezoelectric effect can precisely control the gap between the mask and the wafer, thereby ensuring the consistency and precision of chip manufacturing. The advantages of piezoelectric actuators in mask correction include high precision, strong adjustability, and fast speed, which are crucial for improving the accuracy and efficiency of the chip manufacturing process.

Figure 1 - Mask Alignment Stage Based on Piezoelectric Inertial Drive Technology